Products > IC Sockets > LSPACK Features
LSPACK Features
- Screws M2x6mm, 4pcs.(for fixing HQPACK onto NQPACK) LSPACK can load BGA device in combination with BGA size socket.
- Using BSSOCKET in combination with CSSOCKET having same size as BGA device, necessary height can gained and even tall components can be placed around BGA pad.
- complying with demand of narrow pitch up to 0.4mm.
- As a low cost solution, TET's ICPLUG loading BGA device can be also chosen because ICPLUG is directly mated with mated with BSSOCKET without using LSPACK.
LSPACK BGA mounting surface
(pogo pin)target board surface
(solder ball)