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(11) SSOP Conversion Board applying side surface wiring technology.
Customer's Request
- to connect SSOP pad with B to B connector and to connect with emulatar or IC device.
- to use existing SSOP pad without modifying.
- to use chip size size socket as there are parts around pad.
Our Proposal
- side surface wiring technology on board to realize chip size.
- to reduce width, TET target connector (SICA) to be adopted.
