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TOP > Products > Development Examples of custom Products > Package Conversion Board miniaturized with half through hole technology.
(3) Package Conversion Board miniaturized with half through hole technology.
Customer's Request
- to mount another IC device as the current IC has been maintained.
- to mount other logic circuits or other ICs, maintaining current QFP or BGA foot pattern.
Our Proposal
- space saving and simple wiring package conversion board by adopting half through hole technology.
- board designing with adjusted impedance.
