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TOP > Products > Development Examples of custom Products > BGA Socket having lock mechanism with graduation to accept extra device thichkness.
(6) BGA Socket having lock mechanism with graduation to accept extra device thichkness.
Customer's Request
- to accept extra thickness of device caused by production yield and to
improve contactability between solder ball and pin.
- to improve work efficiency
Our Proposal
- Rotary type knob to be adopted.
- one touch mechanism to be adopted without screwing.
- With torque graduation indicator, torque control is easier.
- Bottom death center stopper mechanism protects BGA device.
