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(6) BGA Socket having lock mechanism with graduation to accept extra device thichkness.

Customer's Request

  • to accept extra thickness of device caused by production yield and to
    improve contactability between solder ball and pin.


  • to improve work efficiency

Our Proposal

  • Rotary type knob to be adopted.


  • one touch mechanism to be adopted without screwing.


  • With torque graduation indicator, torque control is easier.


  • Bottom death center stopper mechanism protects BGA device.






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